Socket that engages a pin grid array

ABSTRACT

An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

This application is a continuation of U.S. patent application Ser. No.11/610,635, filed on Dec. 14, 2006, now issued as U.S. Pat. No.7,361,044, which is incorporated herein by reference.

TECHNICAL FIELD

Some example embodiments of the present invention relate to a socketthat engages an electronic package, and more particularly to a socketthat engages a pin grid array on an electronic package.

BACKGROUND

The processors in integrated circuits and other electronic assembliesare continually being required to handle an ever-increasing number ofsignals. A typical processor often requires additional signals in orderto operate at higher frequencies and to simultaneously perform morelogic and memory operations.

Electrical sockets are often used to secure electronic packages thatinclude processors onto a system board (e.g., a mother board or aprinted circuit board (PCB)). Most sockets are typically constructed foreasy installation and replacement of the electronic packages.

Many sockets include contacts that are assembled within the socket toprovide an electrical connection between the system board and theelectronic package that includes the processor. Solder balls are usuallyattached to each contact so that a reflow process bonds the socket tothe PCB.

There is a need for a socket that has a higher contact density in orderto increase the number of signals that may be simultaneously sent to aprocessor which is within an electronic package. In addition, increasingthe contact density within a socket may allow the overall size of anelectronic package to be reduced depending on the configuration of theelectronic system that includes the processor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a portion of an examplesocket.

FIG. 2 is an enlarged perspective view of the socket shown in FIG. 1.

FIG. 3 is an enlarged perspective view of the socket shown in FIG. 1with a contact attached to the base of the socket and the contact shownagain from another perspective.

FIG. 4 is a side view of the contact shown in FIG. 3.

FIG. 5 is a perspective view illustrating a portion of another examplesocket.

FIG. 6 is a perspective view illustrating another portion of anotherform of the example socket shown in FIG. 5.

FIG. 7 is a perspective view of the example socket shown in FIG. 6 withthe contacts removed from the socket.

FIG. 8 is a perspective view illustrating another portion of anotherform of the example socket shown in FIG. 5.

FIG. 9 is a perspective view of the example socket shown in FIG. 8 withthe contacts removed from the socket.

FIG. 10 illustrates schematic side views of an electronic system thatincludes a socket which engages an electronic package with a pin gridarray.

FIG. 11 is a perspective view illustrating a portion of an examplesocket that may be used in the electronic system shown in FIG. 10.

FIG. 12 is an enlarged perspective view of the socket shown in FIG. 11.

FIG. 13 is an enlarged perspective view illustrating a portion of thesocket shown in FIG. 11 with a contact attached to the base of thesocket and the contact shown again from another perspective.

FIG. 14 is a schematic side view illustrating a portion of the socketshown in FIG. 11 where a pin is shown moving to engage a flat section ofthe contact.

FIG. 15 is a perspective view illustrating a portion of another form ofthe example socket shown in FIG. 11.

FIG. 16 is a perspective view of the example socket shown in FIG. 15with the contacts removed from the socket.

FIG. 17 is a perspective view of the example socket shown in FIG. 15with pins engaging the contacts in the socket.

FIG. 18 is a perspective view illustrating a portion of another form ofthe example socket shown in FIG. 11.

FIG. 19 is a perspective view of the example socket shown in FIG. 18with the contacts removed from the socket.

FIG. 20 is a perspective view of the example socket shown in FIG. 18with pins engaging the contacts in the socket.

DETAILED DESCRIPTION

The following detailed description references the accompanying drawings.Like numerals describe substantially similar components throughout eachof the drawings. Other embodiments may be used, and structural, logical,and electrical changes made. The sockets and electronic systemsdescribed herein can be manufactured, used, or shipped in a number ofpositions and orientations.

In some embodiments, the socket and the electronic system provide acurrent path for supplying signals to a processor. Signals are suppliedto a processor, or die, using contacts that are included in the socket.The configuration of the socket allows the socket size to be minimizedand/or additional signals to be delivered to the processor.

FIGS. 1-3 illustrate an example socket 10 for an electronic package. Thesocket 10 includes a plurality of contacts 12 and a base 14. The base 14includes exterior walls 16A, 16B, 16C, 16D and a plurality of interiorwalls 18 which extend between the exterior walls 16A, 16B, 16C, 16D toform a plurality of openings 20 within the base 14 such that eachopening 20 in the base 14 includes one of the plurality of contacts 12.Although each opening 20 in FIGS. 1 and 2 is shown as being the samesize, the plurality of interior walls 18 may form openings of more thanone size.

As shown most clearly in FIG. 2 because the contacts 12 are removed fromthe socket 10, at least some of the interior walls 18 includeindentations 22. The indentations 22 are adapted to receive projections24 on the contacts 12 (see FIG. 3) such that when the projections 24 onthe contacts 12 are positioned within indentations 22 in the interiorwalls 18, the contacts 12 are secured to the base 14. Although eachindentation 22 and projection 24 in FIGS. 2 and 3 is shown as having arectangular shape, the size and shape of the indentations 22 andprojections 24 may be modified to facilitate insertion and holding ofthe contacts 12 within the openings 20.

FIGS. 2 and 3 show that opposing sides 26A, 26B of some (or all) of theopenings 20 in the base 14 may include indentations 22. However, theindentations 22 may be on any or all sides of the openings 20.

In some embodiments, each contact 12 may include four projections 24that extend into four indentations 22 in the interior walls 18 of thebase 12. FIG. 3 shows an example embodiment where two of the fourprojections 24 on each contact 12 extend into indentations 22 in aninterior wall 18 on one side 26A of an opening 20 and the other twoprojections 24 on each contact 12 extend into indentations 22 in aninterior wall 18 on an opposing side 26B of the opening 20. The numberand location of the indentations 22 will depend in part on the design ofthe projections 24 on the contacts 12.

As shown in FIGS. 3 and 4, each contact 12 may include a flat section 30and a pair of arms 32 that extend from the flat section 30. In someembodiments, the flat section 30 of each contact 12 may include theprojections 24 that extend into the indentations 22 in the interiorwalls 18 of the base 14.

In addition, each contact 12 may be positioned within an opening 20 suchthat the flat section 30 of each contact 12 is positioned against one ofthe interior walls 18 that form the opening 20 (see FIG. 3). The sizeand shape of the flat section 30 and the arms 32 will depend in part onthe size of the openings 20 in the base 14 and other designconsiderations that are associated with an electronic system thatincludes the socket 10.

FIG. 5 illustrates another example socket 40 for an electronic package.The socket 40 includes a plurality of contacts 42 and a base 44. Thebase 44 includes exterior walls 46A, 46B, 46C, 46D and a plurality ofinterior walls 48. A first group 50 of the interior walls 48 is orientedin a first direction X and a second group 52 of the interior walls 48 isoriented in a second direction Y that is orthogonal to the firstdirection X.

The first and second groups 50, 52 of interior walls 48 form a pluralityof openings 54 within the base 44 such that each opening 54 in the base44 includes one of the plurality of contacts 42. Although each opening54 in FIG. 5 is shown as being the same size, the plurality of interiorwalls 48 may form openings 54 of more than one size.

In the illustrated example embodiment, the first group 50 of interiorwalls 48 is higher than the second group 52 of interior walls 48. Thedegree to which the first group 50 of interior walls 48 is higher thanthe second group 52 of interior walls 48 will depend in part on thedesign of any pin grid arrays that get connected to the contacts 42which are part of the socket 40.

As shown in FIGS. 6 and 7, each of the interior walls 48 in the firstgroup 50 of interior walls 48 may include a stepped section 56 on eachside of the interior walls 48 in the first group 50 of interior walls48. In addition, the stepped sections 56 may be located on the firstgroup 50 of interior walls 48 such that the stepped sections 56 arehigher than the second group 52 of interior walls 48 (see FIG. 7). Thestepped sections 56 may permit the overall pitch of the socket 40 to bereduced because the stepped sections 56 allow more relative movement ofthe arms on the contacts 42 when pins in a pin grid array are mated withthe contacts 42.

As shown in FIGS. 8 and 9, each of the interior walls 48 in the firstgroup 50 of interior walls 48 may include a tapered section 58 on theinterior walls 48 in the first group 50 of interior walls 48. Inaddition, the tapered sections 58 may be located on the first group 50of interior walls 48 such that the tapered sections 58 are higher thanthe second group 52 of interior walls 48 (see FIG. 9). The taperedsections 58 may permit the overall pitch of the socket 40 to be reducedbecause the tapered sections 58 allow more relative movement of the armson the contacts 42 when pins in a pin grid array are mated with thecontacts 42.

FIG. 10 illustrates an example electronic system 70 that includes anelectronic package 72. The electronic package 72 includes a die 74 and apin grid array that is electrically connected to the die 74.

The electronic system 70 further includes a socket 80. The socket 80includes a base 81 and a plurality of contacts 82 which engage the pins77 in the pin grid array. It should be noted that the number, locationand size of the pins 77 in the pin grid array will depend in part on thetype of die 74 that is included in the electronic system 70 as well asthe type of applications where the electronic system 70 will be used.

In some embodiments, the electronic system 70 may further include aprinted circuit board 78 such that the socket 80 is mounted to theprinted circuit board 78. As an example, the socket 80 may be mounted tothe printed circuit board 78 using a ball grid array.

As shown in FIG. 11, the base 81 includes exterior walls 83A, 83B, 83C,83D and a plurality of interior walls 84. A first group 85 of theinterior walls 84 may be oriented in a first direction X and a secondgroup 86 of the interior walls 84 may be oriented in a second directionY that is orthogonal to the first direction X.

The first and second groups 85, 86 of interior walls 84 form a pluralityof openings 87 within the base 81 such that each opening 87 in the base81 includes one of the contacts 82. Although each opening 87 in FIG. 11is shown as being the same size, the plurality of interior walls 84 mayform openings 87 of more than one size.

In the illustrated example embodiment, the first group 85 of interiorwalls 84 is higher than the second group 86 of interior walls 84. Thedegree to which the first group 85 of interior walls 84 is higher thanthe second group 86 of interior walls 84 will depend in part on thedesign of the pin grid array that gets connected to the contacts 82.

As shown in FIGS. 12 and 13, at least some of the interior walls 84 mayinclude indentations 90 that receive projections 91 on the contacts 82such that when the projections 91 on the contacts 82 are positionedwithin indentations 90 in the interior walls 84, the contacts 82 aresecured to the base 81. In the example embodiment that is illustrated inFIG. 12, the indentations 90 include a base wall 98 and four side walls99A, 99B, 99C, 99D.

In some embodiments, the interior walls 84 in the first group 85 ofinterior walls 84 include the indentations 90. Although each indentation90 and projection 91 in FIGS. 12 and 13 is shown as having a rectangularshape, the size and shape of the indentations 90 and projections 91 maybe modified to facilitate insertion and holding of the contacts 82within the openings 87.

FIGS. 13 and 14 show that the contact 82 may be similar to the contacts12, 42 described above in that each contact 82 may include a flatsection 93 and a pair of arms 94 that extend from the flat section 93.The flat section 93 of each contact 82 may include the projections 91that extend into the indentations 90 in the interior walls 84 of base81. The size and shape of the flat section 93 and the arms 94 willdepend in part on the size of the openings 87 in the base 81 and otherdesign considerations that are associated with the electronic system 70.

As shown in FIGS. 13 and 14, each contact 82 may be positioned within anopening 87 such that the flat section 93 of each contact 82 ispositioned against one of the interior walls 84 in the second group 86of interior walls 84. In addition, the flat section 93 of each contact82 may extend above the second group 86 of interior walls 84 such thatthe flat section 93 acts as a stop to prevent a pin 77 in the pin gridarray from passing over the one of the interior walls 84 in the secondgroup 86 of interior walls 84 (see, e.g., pin 77 movement illustrated inFIG. 14).

FIGS. 15 and 17 show that each of the interior walls 84 in the firstgroup 85 of interior walls 84 may include a stepped section 95 on eachside of the interior walls 84 in the first group 85 of interior walls84. The stepped sections 95 may be located on the first group 85 ofinterior walls 84 such that the stepped sections 95 are higher than thesecond group 86 of interior walls 84 (see FIG. 16).

It should be noted that each arm 94 in the pair of arms on each contact82 may extend toward a stepped section 95 on the interior walls 84 ofthe base 81 when a pin 77 in the pin grid array is inserted between thearms 94 on each contact 82 (see FIG. 17). The stepped sections 95 maypermit the overall pitch of the socket 80 to be reduced because thestepped sections 95 allow more relative movement of the arms 94 on thecontacts 82 when the pins 77 in the pin grid array are mated with thecontacts 82.

FIGS. 18 and 20 show that each of the interior walls 84 in the firstgroup 85 of interior walls 84 may include a tapered section 96 on theinterior walls 84 in the first group 85 of interior walls 84. Thetapered sections 96 may be located on the first group 85 of interiorwalls 84 such that the tapered sections 96 are higher than the secondgroup 86 of interior walls 84 (see FIG. 19).

It should be noted that each arm 94 in the pair of arms on each contact82 may extend toward a tapered section 96 on the interior walls 84 ofthe base 81 when a pin 77 in the pin grid array is inserted between thearms 94 on each contact 82 (se FIG. 20). The tapered sections 96 maypermit the overall pitch of the socket 80 to be reduced because thetapered sections 96 allow more relative movement of the arms 94 on thecontacts 82 when the pins 77 in the pin grid array are mated with thecontacts 82.

Electronic system 70 may be a computer system that includes a system buswhich electrically couples the various components of electronic system70 together. The components in the electronic system 70 will bedetermined based on the space available and the application where theelectronic system 70 is to be used (among other factors). In someembodiments, the electronic system 70 may further include a voltagesource 79 that is electrically coupled to the printed circuit board 78.

In one embodiment, die 74 is a processor which can be of any type. Asused herein, processor means any type of circuit such as, but notlimited to, a microprocessor, a microcontroller, a graphics processor ora digital signal processor.

It should be noted that many types of circuits may form part of die 74.Some example circuits include a custom circuit or anapplication-specific integrated circuit, such as a communicationscircuit for use in wireless devices (e.g., cellular telephones, pagers,portable computers, two-way radios, and similar electronic systems).

Electronic system 70 may also include an external memory that in turnmay include one or more memory elements suitable to a particularapplication, such as a main memory in the form of random access memory(RAM) (see. e.g., RAM 99 in FIG. 10), one or more hard drives, and/orone or more drives that handle removable media, such as diskettes,compact disks (CDs) and digital video disks (DVDs).

The sockets and electronic systems described herein may be implementedin a number of different embodiments. The elements, materials,geometries, and dimensions can all be varied to suit particularpackaging requirements.

FIGS. 1-20 are merely representational and are not drawn to scale.Certain proportions thereof may be exaggerated while others may beminimized.

The sockets and electronic systems described above may provide asolution for supplying additional signals to processors. The design ofthe socket may increase the overall contact density of the sockets thatare used in the electronic systems which include processors. Many otherembodiments will be apparent to those of skill in the art from the abovedescription.

The Abstract is provided to comply with 37 C.F.R. Section 1.72(b)requiring an abstract that will allow the reader to ascertain the natureand gist of the technical disclosure. It is submitted with theunderstanding that it will not be used to limit or interpret the scopeor meaning of the claims. The following claims are hereby incorporatedinto the detailed description, with each claim standing on its own as aseparate embodiment.

1. A socket that engages a pin grid array, the socket comprising: aplurality of contacts; and a base that includes exterior walls and aplurality of interior walls which extend between the exterior walls toform a plurality of openings within the base such that each opening inthe base includes one of the plurality of contacts, at least some of theinterior walls including indentations that receive projections on thecontacts such that when the projections on the contacts are positionedwithin the indentations in the interior walls the contacts are securedto the base, wherein each of the indentations in the interior wallsincludes a base wall and four sidewalls, wherein each contact includesfour projections that extend into four indentations in the interiorwalls of the base.
 2. The socket of claim 1, wherein two of the fourprojections on each contact extend into indentations in an interior wallon one side of an opening and the other two projections on each contactextend into indentations in an interior wall on an opposing side of theopening.
 3. A socket that engages a pin grid array, the socketcomprising: a plurality of contacts; and a base that includes exteriorwalls and a plurality of interior walls which extend between theexterior walls to form a plurality of openings within the base such thateach opening in the base includes one of the plurality of contacts, atleast some of the interior walls including indentations that receiveprojections on the contacts such that when the projections on thecontacts are positioned within the indentations in the interior wallsthe contacts are secured to the base, wherein each of the indentationsin the interior walls includes a base wall and four sidewalls, whereineach contact includes a flat section and a pair of arms that extend fromthe flat section, the flat section of each contact including theprojections that extend into the indentations in the interior walls ofthe base.
 4. The socket of claim 3, wherein each contact is positionedwithin an opening such that the flat section of each contact ispositioned against one of the interior walls that form the opening. 5.The socket of claim 3, wherein each of the openings is the same size. 6.The socket of claim 3, wherein each of the projections on each contacthas a rectangular shape.
 7. The socket of claim 6, wherein each of theindentations has a rectangular shape.
 8. The socket of claim 3, whereineach of the contacts is the same size and shape.